A collaboration of Nippon Telegraph and Telephone Corporation and Tokyo Institute of Technology have developed an ultra high-speed IC for wireless front-end that operates on a terahertz frequency band, and in the 300 GHz band, they have succeeded in developing the world’s fastest 100 gigabits per second wireless transmission data rate.
It is expected that unused terahertz waves can be connected to rapid wireless transmission since a wide frequency band can be secured. In this examination, scientists actualized a mixer circuit that connected a one of a kind proprietary high isolation design technology with an Indium phosphide high electron portability transistor (InP-HEMT).
This broadened the transmission transfer speed, which is an issue in the ordinary 300 GHz band remote front end. It likewise enhanced the signal-to-noise-ratio (SNR). Moreover, utilizing this, scientists understood a 300 GHz band remote front-end module, and accomplished remote transmission of 100 Gbps.
It is expected to be an ultra high-speed IC technology that enables high-capacity wireless transmission of 400 gigabits per second. This is about 400 times the current LTE and Wi-Fi, and 40 times 5G, the next-generation mobile communication technology. It is also expected to be a technology that opens up utilization of the unused terahertz wave frequency band in the communications field and non-communication fields.
The details of this technology will be presented at the 2018 IEEE MTT-S International Microwave Symposium which will be held in Philadelphia in the United States from June 10 to 15.